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Silicone Thermal Pad or called Silicone Based Gap Fillers are used to fill gaps of 0.1 – 10mm between surfaces and lower thermal resistance by excluding air from the interface, usually between heat-generating components (electronic components such as IC, CPU, MOS, LED) and heat sinks, heat spreaders or other cooling devices.

Our Silicone Thermal Pad and Silicone-Based Gap Filler  products have not only high thermal conductivity but also excellently compressive capacity of approx. 25% – 40% which helps to reduce pressure to electronic components

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